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Predicting the Thermal Performance of Electronic Devices

Predicting the Thermal Performance of Electronic Devices

This technical magazine styled article features a variety of thermal management use examples and presents how high-tech companies, such as Huawei Technologies and the Large Hadron Collider team at CERN, use multiphysics simulation for making informed design decisions and better predicting electromagnetic system performance.

Download this paper to:

  • Learn how concurrent investigations of heat transfer mechanisms and factors in a system that cause temperature variations lead to a better understanding of the impact of design changes on a product’s performance.
  • Read how leading engineers use physics interfaces, couplings and postprocessing functionality of COMSOL Multiphysics® to study phenomena such as convective cooling, Joule heating, phase change and thermal expansion.
  • Explore how simulation applications allow for immediate adjustments of a design while streamlining communication between collaborators and increasing the number of people who can meaningfully contribute to a product.

COMSOL is a global provider of simulation software for product design and research to technical enterprises, research labs and universities.

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